High thermal conductivity AIN filler "FAN-f series"
Insulation & high thermal conductivity! Excellent filling and fluidity for various resins, achieving high heat dissipation.
We would like to introduce our high thermal conductivity AlN filler, the "FAN-f series." The AlN filler, obtained by adding a small amount of sintering aid Y2O3 and particle size control agent BN to AlN micropowder with high thermal conductivity and sintering it at high temperatures, exhibits excellent filling and flow properties in various resins such as epoxy resin, silicone resin, and BT resin, achieving high heat dissipation. It can be used in semiconductor encapsulation resins, heat dissipation sheets, and heat dissipation substrates. 【Features】 ■ Insulation & high thermal conductivity ■ Spherical particles ■ High filling rate *For more details, please refer to the PDF document or feel free to contact us.
- Company：古河電子
- Price：Other
